with a principal constituent of the material being a metal or a metalloid

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H01L2924/177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/177with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip package assembly
- Patent number 12,266,631
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 11,637,083
- Issue date Apr 25, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,333
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically insulating thermal interface on the discontinuity of a...
- Patent number 11,049,790
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,978,379
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,879,194
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,811,343
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,756,006
- Issue date Aug 25, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of assembling semiconductor device
- Patent number 10,750,621
- Issue date Aug 18, 2020
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with preferred heat dissipating eff...
- Patent number 10,679,965
- Issue date Jun 9, 2020
- ZOWIE TECHNOLOGY CORPORATION
- Chia-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped lead terminals for packaging a semiconductor device for elec...
- Patent number 10,658,284
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,622,276
- Issue date Apr 14, 2020
- Hyundai Motor Company
- Young Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,573,571
- Issue date Feb 25, 2020
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure of glass substrate, glass substrate and display de...
- Patent number 10,566,306
- Issue date Feb 18, 2020
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Huanda Wu
- G02 - OPTICS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,529,654
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,485
- Issue date Nov 26, 2019
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...
- Publication number 20230290738
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20230260958
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230104156
- Publication date Apr 6, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20220320038
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366796
- Publication date Nov 25, 2021
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035931
- Publication date Feb 4, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200404794
- Publication date Dec 24, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20200365494
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...
- Publication number 20200258818
- Publication date Aug 13, 2020
- STMicroelectronics (Tours) SAS
- Samuel MENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...
- Publication number 20200144145
- Publication date May 7, 2020
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20200053883
- Publication date Feb 13, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20200020616
- Publication date Jan 16, 2020
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING STRUCTURE OF GLASS SUBSTRATE, GLASS SUBSTRATE AND DISPLAY DE...
- Publication number 20190385970
- Publication date Dec 19, 2019
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Huanda WU
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
- Publication number 20190385937
- Publication date Dec 19, 2019
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20190172776
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20190122967
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20190043799
- Publication date Feb 7, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip-chip package assembly

Hermetic package for high CTE mismatch

Electronic device with multi-layer contact and system

Hermetic package for high CTE mismatch

Semiconductor device

Package for a semiconductor device

Flip chip package assembly

Electronic device with multi-layer contact and system

Flip-chip package assembly

Semiconductor device

Semiconductor device

Bottom package exposed die MEMS pressure sensor integrated circuit...

Electrically insulating thermal interface on the discontinuity of a...

Semiconductor device and method of making a semiconductor device

Wafer-level chip-scale package including power semiconductor and ma...

Semiconductor device with island and associated leads

Semiconductor device package and method of manufacturing the same

Method of making a wire support leadframe for a semiconductor device

Leadless semiconductor packages, leadframes therefor, and methods o...

Process of assembling semiconductor device

Integrated circuit device with plating on lead interconnection poin...

Semiconductor package structure with preferred heat dissipating eff...

Shaped lead terminals for packaging a semiconductor device for elec...

Power module

Wafer-level chip-scale package including power semiconductor and ma...

Wiring structure of glass substrate, glass substrate and display de...

Wire support for a leadframe

Chip package and a wafer level package

Semiconductor device

Bottom package exposed die MEMS pressure sensor integrated circuit...

Patents Applicationslast 30 patents

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

PACKAGE AND SEMICONDUCTOR DEVICE

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

FLIP CHIP PACKAGE ASSEMBLY

CHIP PROTECTION DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...

Flip-Chip Package Assembly

FLIP CHIP PACKAGE ASSEMBLY

PACKAGE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

Flip-Chip Package Assembly

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...

WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...

Electronic Device with Multi-Layer Contact and System

PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

WIRING STRUCTURE OF GLASS SUBSTRATE, GLASS SUBSTRATE AND DISPLAY DE...

SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS

Method Of Making A Wire Support Leadframe For A Semiconductor Device

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Method for Producing Electronic Device With Multi-Layer Contact

Integrated Circuit Device with Plating on Lead Interconnection Poin...