with a principal constituent of the material being a metal or a metalloid

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H01L2224/136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/136with a principal constituent of the material being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Imaging device and method for manufacturing imaging device
- Patent number 12,356,753
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
- Patent number 12,322,690
- Issue date Jun 3, 2025
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,293,988
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of flip chip package structure
- Patent number 12,266,620
- Issue date Apr 1, 2025
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device with chip to package interconnects from a copper metal in...
- Patent number 12,261,141
- Issue date Mar 25, 2025
- Texas Instruments Incorporated
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods for forming the same
- Patent number 12,033,933
- Issue date Jul 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaimin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing the same
- Patent number 11,973,046
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,923,332
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226344
- Publication date Jul 10, 2025
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-SHELL BALL GRID ARRAY MATERIALS FOR LARGE FORM FACTOR INTEGRAT...
- Publication number 20250218992
- Publication date Jul 3, 2025
- Intel Corporation
- Rui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER COMPOSITION, METHOD OF PREPARING THE SAME, AND METHOD OF MAN...
- Publication number 20250214181
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Yuho Won
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20250201751
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
- Publication number 20250201720
- Publication date Jun 19, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192083
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING SOLDER INTERCONNECTION
- Publication number 20250157968
- Publication date May 15, 2025
- META PLATFORMS, INC.
- Pradip Sairam PICHUMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20250096174
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038156
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR POWER METAL LINES
- Publication number 20240379603
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Imaging device and method for manufacturing imaging device

Semiconductor structure having copper pillar within solder bump and...

Device and method for UBM/RDL routing

Circuit packages and fabrication methods using bond-on-pad (BoP) su...

Semiconductor package

Semiconductor package and method of forming the same

Semiconductor device package and method for manufacturing the same

Manufacturing method of flip chip package structure

IC device with chip to package interconnects from a copper metal in...

Superconducting bump bonds for quantum computing systems

Semiconductor package with intermetallic-compound solder-joint comp...

Manufacturing method of an electronic apparatus

Semiconductor device

Semiconductor device including a semiconductor element having elect...

Light-emitting device and displayer

Semiconductor package and manufacturing method thereof

Scalable quantum processor design

Package structure and manufacturing method thereof

Semiconductor structures and methods for forming the same

Packaged semiconductor device with electroplated pillars

Structures for low temperature bonding using nanoparticles

Multiple plated via arrays of different wire heights on a same subs...

Method of forming brass-coated metals in flip-chip redistribution l...

Semiconductor structure and method for preparing the same

Methods for low temperature bonding using nanoparticles

Semiconductor device and method for manufacturing the same

Solderless interconnection structure and method of forming same

Flip chip package structure and manufacturing method thereof

Semiconductor die with capillary flow structures for direct chip at...

Multilayer substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CORE-SHELL BALL GRID ARRAY MATERIALS FOR LARGE FORM FACTOR INTEGRAT...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SOLDER COMPOSITION, METHOD OF PREPARING THE SAME, AND METHOD OF MAN...

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SELF-HEALING SOLDER INTERCONNECTION

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE AND METHOD FOR POWER METAL LINES

ELECTRONIC PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Coating of Nanowires

ELECTRONIC DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME