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with a principal constituent of the material being a metal or a metalloid
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Industry
CPC
H01L2224/379
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/379
with a principal constituent of the material being a metal or a metalloid
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Patents Grants
last 30 patents
Patents Applications
last 30 patents
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Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
Publication number
20130292168
Publication date
Nov 7, 2013
ROBERT BOSCH GmbH
Daniel Wolde-Giorgis
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...