with a principal constituent of the material being a metal or a metalloid

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H01L2224/458

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/458with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,773,748
- Issue date Sep 26, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating a coated metallic wire, method of removing in...
- Patent number 6,640,436
- Issue date Nov 4, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated fine metallic wire and method for fabricating semiconductor...
- Patent number 6,239,376
- Issue date May 29, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170179064
- Publication date Jun 22, 2017
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package capable of absorbing electromagnetic wave
- Publication number 20050093112
- Publication date May 5, 2005
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS