with a principal constituent of the material being a metal or a metalloid

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H01L2224/836

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/836with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
- Patent number 10,685,931
- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wafer integration with catalytic laminate or adh...
- Patent number 9,922,951
- Issue date Mar 20, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint structure, power module, power module substrate with h...
- Patent number 9,355,986
- Issue date May 31, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-reflective anisotropic conductive paste and light-emitting de...
- Patent number 8,710,662
- Issue date Apr 29, 2014
- Sony Corporation & Information Device Corporation
- Hideaki Umakoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,217,403
- Issue date Jul 10, 2012
- Napra Co., Ltd
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and Apparatus for forming Contacts on an Integrated Circuit...
- Publication number 20180158793
- Publication date Jun 7, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140054757
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Keiko Ikuta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE PASTE AND LIGHT-EMITTING DE...
- Publication number 20120248495
- Publication date Oct 4, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hideaki Umakoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive bonding composition and method of use

Method for electrically contacting a component by galvanic connecti...

Adhesive bonding composition and method of use

Method and apparatus for forming contacts on an integrated circuit...

Die with integrated microphone device using through-silicon vias (T...

Adhesive bonding composition and method of use

Integrated circuit wafer integration with catalytic laminate or adh...

Preform structure for soldering a semiconductor chip arrangement, a...

Solder joint structure, power module, power module substrate with h...

Light-reflective anisotropic conductive paste and light-emitting de...

Electronic element unit and reinforcing adhesive agent

Electronic device

Patents Applicationslast 30 patents

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Method and Apparatus for forming Contacts on an Integrated Circuit...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE PASTE AND LIGHT-EMITTING DE...

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT