with a principal constituent of the material being a metal or a metalloid

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H01L2224/297

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/297with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
- Publication number 20240282741
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Film Forming Compositions
- Publication number 20220017673
- Publication date Jan 20, 2022
- Fujifilm Electronic Materials U.S.A., Inc.
- Sanjay Malik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
- Publication number 20180315729
- Publication date Nov 1, 2018
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Nanoscopic Assurance Coating for Lead-Free Solders
- Publication number 20080075872
- Publication date Mar 27, 2008
- Joseph D. Lichtenhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR