with a principal constituent of the material being a metal or a metalloid

Industry

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/298with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet, method for manufacturing semiconductor device using...
- Patent number 9,779,976
- Issue date Oct 3, 2017
- Hitachi Automotive Systems, Ltd.
- Satoshi Ikeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Driving circuit for a liquid crystal display device, method of manu...
- Patent number 8,576,368
- Issue date Nov 5, 2013
- Samsung Display Co., Ltd.
- Yun-Hee Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component bonding method and apparatus using vibration e...
- Patent number 8,287,670
- Issue date Oct 16, 2012
- Korea Advanced Institute of Science and Technology
- Kyung-Soo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film, connecting method, and joined structure
- Patent number 8,158,887
- Issue date Apr 17, 2012
- Sony Corporation
- Tomoyuki Ishimatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive particles for anisotropic conductive interconnection
- Patent number 8,089,151
- Issue date Jan 3, 2012
- Cheil Industries, Inc.
- Jung Bae Jun
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of producing electro-optical device using anisotropic conduc...
- Patent number 8,016,181
- Issue date Sep 13, 2011
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit having terminal for measuring bump...
- Patent number 7,786,478
- Issue date Aug 31, 2010
- Kabushiki Kaisha Toshiba
- Akiji Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 7,304,394
- Issue date Dec 4, 2007
- Sharp Kabushiki Kaisha
- Toshiharu Seko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving an integrated circuit device
- Patent number 7,000,821
- Issue date Feb 21, 2006
- Intel Corporation
- Terry Sterrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with covalently bonded connection structure
- Patent number 6,586,843
- Issue date Jul 1, 2003
- Intel Corporation
- Terry Sterrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor device using anisotropic conducti...
- Patent number 6,498,051
- Issue date Dec 24, 2002
- Citizen Watch Co., Ltd.
- Makoto Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices employing adhesive interconnections including pl...
- Patent number 6,297,564
- Issue date Oct 2, 2001
- Amerasia International Technology, Inc.
- Kevin Kwong-Tai Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
- Publication number 20240282741
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME
- Publication number 20210050498
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECH...
- Publication number 20120213980
- Publication date Aug 23, 2012
- Volker Arning
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...
- Publication number 20110267791
- Publication date Nov 3, 2011
- Hitachi Chemical Company, Ltd.
- Katsuhiko Tomisaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE...
- Publication number 20110121243
- Publication date May 26, 2011
- Hitachi Chemical Company, Ltd.
- Nobuaki Takane
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLIP CHIP PACKAGE
- Publication number 20110115078
- Publication date May 19, 2011
- Samsung Electronics Co., Ltd.
- Se-Young JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USI...
- Publication number 20100317155
- Publication date Dec 16, 2010
- Byoung-Un Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD AND APPARATUS USING VIBRATION E...
- Publication number 20100206457
- Publication date Aug 19, 2010
- Korea Advanced Institute of Science and Technology (KAIST)
- Kyung-Soo KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...
- Publication number 20100139947
- Publication date Jun 10, 2010
- HITACHI CHEMICAL COMPANY, LTD.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE
- Publication number 20100116533
- Publication date May 13, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki ISHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE...
- Publication number 20100110652
- Publication date May 6, 2010
- Hitachi Chemical Company, Ltd.
- Nobuaki Takane
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT HAVING TERMINAL FOR MEASURING BUMP...
- Publication number 20090315029
- Publication date Dec 24, 2009
- Kabushiki Kaisha Toshiba
- Akiji Kudo
- G02 - OPTICS
Information Patent Application
METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE
- Publication number 20090197111
- Publication date Aug 6, 2009
- SEIKO EPSON CORPORATION
- Munehide Saimen
- G02 - OPTICS
Information Patent Application
Advanced Anisotropic Insulated Conductive Ball For Electric Connect...
- Publication number 20080237545
- Publication date Oct 2, 2008
- Hanwha Chemical Corporation
- Eui-Deok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic Conductive Particles and Manufacturing Method Thereof
- Publication number 20080206567
- Publication date Aug 28, 2008
- DONGBU HITEK CO., LTD.
- Byung Hoon Min
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Driving circuit for a liquid crystal display device, method of manu...
- Publication number 20080180376
- Publication date Jul 31, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Yun-Hee Kim
- G02 - OPTICS
Information Patent Application
Nanoscopic Assurance Coating for Lead-Free Solders
- Publication number 20080075872
- Publication date Mar 27, 2008
- Joseph D. Lichtenhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip and flat panel display apparatus comprising the same
- Publication number 20070284760
- Publication date Dec 13, 2007
- Eun-Ah Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive particles for anisotropic conductive interconnection
- Publication number 20070145585
- Publication date Jun 28, 2007
- Jung Bae Jun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device and method for manufacturing same
- Publication number 20050224939
- Publication date Oct 13, 2005
- Toshiharu Seko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of microelectrode connection and connected structure of use...
- Publication number 20050211464
- Publication date Sep 29, 2005
- Jeong Il Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for improving an integrated circuit device
- Publication number 20040104261
- Publication date Jun 3, 2004
- Terry Sterrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving an integrated circuit device
- Publication number 20030087475
- Publication date May 8, 2003
- Terry Sterrett
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and formation method of chip package with protective lid

Adhesive sheet, method for manufacturing semiconductor device using...

Electrically conductive bonding material, method of bonding with th...

Driving circuit for a liquid crystal display device, method of manu...

Electronic component bonding method and apparatus using vibration e...

Adhesive film, connecting method, and joined structure

Conductive particles for anisotropic conductive interconnection

Method of producing electro-optical device using anisotropic conduc...

Semiconductor integrated circuit having terminal for measuring bump...

Semiconductor device and method for manufacturing same

Method and apparatus for improving an integrated circuit device

Integrated circuit device with covalently bonded connection structure

Method of packaging semiconductor device using anisotropic conducti...

Electronic devices employing adhesive interconnections including pl...

Patents Applicationslast 30 patents

Metal Nitride Core-Shell Particle Die-Attach Material

PACKAGE STRUCTURE WITH PROTECTIVE LID

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME

METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECH...

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE...

FLIP CHIP PACKAGE

MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USI...

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

ELECTRONIC COMPONENT BONDING METHOD AND APPARATUS USING VIBRATION E...

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...

ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE...

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING TERMINAL FOR MEASURING BUMP...

METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE

Advanced Anisotropic Insulated Conductive Ball For Electric Connect...

Plastic Conductive Particles and Manufacturing Method Thereof

Driving circuit for a liquid crystal display device, method of manu...

Nanoscopic Assurance Coating for Lead-Free Solders

Chip and flat panel display apparatus comprising the same

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method for manufacturing same

Method of microelectrode connection and connected structure of use...

Method and apparatus for improving an integrated circuit device

Method and apparatus for improving an integrated circuit device