with a principal constituent of the material being a metal or a metalloid

Industry

CPC
H01L2224/815

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/815with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,177,249
- Issue date Nov 16, 2021
- SK hynix Inc.
- Kun Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET with reduced resistance
- Patent number 10,707,327
- Issue date Jul 7, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Electrical connector
- Patent number 9,439,298
- Issue date Sep 6, 2016
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for producing component mounting board
- Patent number 9,237,686
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure and manufacturing method thereof, and electronic...
- Patent number 8,345,435
- Issue date Jan 1, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji Hamatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board structure, and a circuit b...
- Patent number 8,225,499
- Issue date Jul 24, 2012
- Imbera Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connected body and optical transceiver module
- Patent number 8,027,553
- Issue date Sep 27, 2011
- Hitachi Cable, Ltd.
- Toshiaki Takai
- G02 - OPTICS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
RFID tag and method of manufacturing the same
- Patent number 7,298,265
- Issue date Nov 20, 2007
- Fujitsu Limited
- Naoki Ishikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a bump having a rugged side
- Patent number 6,088,236
- Issue date Jul 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding electronic components
- Patent number 5,817,542
- Issue date Oct 6, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump having a rugged side, a semiconductor devi...
- Patent number 5,545,589
- Issue date Aug 13, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic parts loaded module including thermal stress absorbing p...
- Patent number 5,422,516
- Issue date Jun 6, 1995
- Hitachi, Ltd.
- Takashi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200243499
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Kun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...
- Publication number 20140217618
- Publication date Aug 7, 2014
- Harris Corporation
- Andrew Craig KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD
- Publication number 20140158751
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20130329391
- Publication date Dec 12, 2013
- NEC Corporation
- Naomi ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sloped Surface in Patter...
- Publication number 20130113118
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MAGNETIC PARTICLE ATTACHMENT MATERIAL
- Publication number 20110278351
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20110032684
- Publication date Feb 10, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji HAMATANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20100319974
- Publication date Dec 23, 2010
- Naomi Ishizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT B...
- Publication number 20090014872
- Publication date Jan 15, 2009
- Imbera Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTED BODY AND OPTICAL TRANSCEIVER MODULE
- Publication number 20080310854
- Publication date Dec 18, 2008
- Toshiaki Takai
- G02 - OPTICS
Information Patent Application
Direct Die Attachment
- Publication number 20080169574
- Publication date Jul 17, 2008
- Nokia Corporation
- Petri Molkkari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID tag and method of manufacturing the same
- Publication number 20060131426
- Publication date Jun 22, 2006
- FUJITSU LIMITED
- Naoki Ishikawa
- G06 - COMPUTING CALCULATING COUNTING

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding interposer and integrated circuit chip, and ultrasound prob...

Semiconductor memory device and method of manufacturing the same

MOSFET with reduced resistance

Semiconductor device and corresponding method

Mounting structure and method for manufacturing same

Mounting structure and method for manufacturing same

Mounted structure and manufacturing method of mounted structure

Electronic component-mounted structure, IC card and COF package

Electrical connector

Electrical connector

Method and system for producing component mounting board

Electronic element unit and reinforcing adhesive agent

Electroconductive bonding material, method for bonding conductor, a...

Terminal structure and manufacturing method thereof, and electronic...

Method for manufacturing a circuit board structure, and a circuit b...

Connected body and optical transceiver module

Electronic element that includes multilayered bonding interface bet...

RFID tag and method of manufacturing the same

Semiconductor device having a bump having a rugged side

Method for bonding electronic components

Method of forming a bump having a rugged side, a semiconductor devi...

Electronic parts loaded module including thermal stress absorbing p...

Patents Applicationslast 30 patents

TERMINAL AND CONNECTION METHOD

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...

METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

ELECTRONIC DEVICE

Semiconductor Device and Method of Forming Sloped Surface in Patter...

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

MAGNETIC PARTICLE ATTACHMENT MATERIAL

TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

Electronic Element, Electronic Element Device Using the Same, and M...

METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT B...

CONNECTED BODY AND OPTICAL TRANSCEIVER MODULE

Direct Die Attachment

RFID tag and method of manufacturing the same