with a principal constituent of the material being a metal or a metalloid

Industry

CPC
H01L2924/157

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/157with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive paste
- Patent number 11,817,398
- Issue date Nov 14, 2023
- Namics Corporation
- Masashi Kajita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of housing for semiconductor device
- Patent number 11,806,903
- Issue date Nov 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071900
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063103
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
- Publication number 20240063127
- Publication date Feb 22, 2024
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20240019106
- Publication date Jan 18, 2024
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240021562
- Publication date Jan 18, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20230361043
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20230326876
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20230326895
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ENGINE BASED ON SILICON PHOTONICS TSV INTERPOSER
- Publication number 20230299008
- Publication date Sep 21, 2023
- Marvell Asia Pte Ltd.
- Liang DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING...
- Publication number 20230299462
- Publication date Sep 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20230281908
- Publication date Sep 7, 2023
- TMRW Foundation IP S. À R.L.
- Cevat YERLI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20230282530
- Publication date Sep 7, 2023
- Mitsubishi Electric Corporation
- Wakana NOBORU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CE...
- Publication number 20230144181
- Publication date May 11, 2023
- MURATA MANUFACTURING CO., LTD.
- Takuya GOITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20230137296
- Publication date May 4, 2023
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130373
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230014848
- Publication date Jan 19, 2023
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230008518
- Publication date Jan 12, 2023
- AMOSENSE CO.,LTD
- Ji-Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE...
- Publication number 20220406695
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Siqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Package for a semiconductor device

3D semiconductor device and structure with bonding

Semiconductor structure and manufacturing method thereof

Semiconductor device

3D semiconductor device and structure with memory

Semiconductor device and manufacturing method thereof

Semiconductor package with routing patch and conductive interconnec...

3D semiconductor device and structure with single-crystal layers

Method of forming a chip package and chip package

Hybrid felts of electrospun nanofibers

Method for producing a 3D semiconductor device and structure with m...

Semiconductor die connection system and method

Solder material

Methods for producing a 3D semiconductor device and structure with...

Semiconductor package with nickel-silver pre-plated leadframe

Semiconductor package with layer structures, antenna layer and elec...

3D semiconductor device and structure with bonding

Conductive paste

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Manufacturing method of housing for semiconductor device

Semiconductor element bonding structure, method for producing semic...

High density substrate routing in package

Methods for producing a 3D semiconductor device and structure with...

Laminate and electronic device

Electrical interconnect bridge

3D semiconductor device and structure with bonding

Anisotropic conductive film and method of producing the same

Low cost package warpage solution

Semiconductor module and method for manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS

Illumination apparatus

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

LOW COST PACKAGE WARPAGE SOLUTION

ELECTRICAL INTERCONNECT BRIDGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

Semiconductor Die Connection System and Method

LIGHT ENGINE BASED ON SILICON PHOTONICS TSV INTERPOSER

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

GAME ENGINE ON A CHIP

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CE...

Illumination apparatus

SEMICONDUCTOR DEVICE

PACKAGE FOR A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE...

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...