with a principal constituent of the material being a metal or a metalloid

Industry

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H01L2224/134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/134with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particle and articles formed therefrom
- Patent number 10,507,551
- Issue date Dec 17, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and electroconductive paste formed therefrom
- Patent number 10,478,924
- Issue date Nov 19, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintered body made from silver fine particles
- Patent number 10,369,667
- Issue date Aug 6, 2019
- NAMICS CORPORATION
- Makoto Kobayashi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package with SoC and integrated memory
- Patent number 10,290,620
- Issue date May 14, 2019
- Apple Inc.
- John Bruno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 10,109,605
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate, package system using the same and...
- Patent number 10,062,623
- Issue date Aug 28, 2018
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particles having intermetallic compound nano-composite struct...
- Patent number 10,016,848
- Issue date Jul 10, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20200093008
- Publication date Mar 19, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...
- Publication number 20190206822
- Publication date Jul 4, 2019
- Intel Corporation
- Ji Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20190057946
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM
- Publication number 20180311771
- Publication date Nov 1, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ARTICLES FORMED THEREFROM
- Publication number 20180290243
- Publication date Oct 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE
- Publication number 20170282302
- Publication date Oct 5, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20170256511
- Publication date Sep 7, 2017
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND
- Publication number 20160093584
- Publication date Mar 31, 2016
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20140353819
- Publication date Dec 4, 2014
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guard Ring Design for Maintaining Signal Integrity
- Publication number 20140183690
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Structures for Post-Passivation Interconnect
- Publication number 20140151698
- Publication date Jun 5, 2014
- TAIWAN SEMICONDUCTOR MANUFACTUING COMPANY, LTD.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
- Publication number 20130001757
- Publication date Jan 3, 2013
- Tessera. Inc.
- Chok Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20120139126
- Publication date Jun 7, 2012
- Hynix Semiconductor Inc.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME
- Publication number 20120028458
- Publication date Feb 2, 2012
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20110260317
- Publication date Oct 27, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFA...
- Publication number 20110005822
- Publication date Jan 13, 2011
- Yuuki Momokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SE...
- Publication number 20100221559
- Publication date Sep 2, 2010
- Kaoru Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20090246474
- Publication date Oct 1, 2009
- Panasonic Corporation
- Daisuke Sakurai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component built-in substrate and method for manufacturin...
- Publication number 20080165513
- Publication date Jul 10, 2008
- Shinko Electric Industries Co., Ltd.
- Akinobu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20070117274
- Publication date May 24, 2007
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20070084629
- Publication date Apr 19, 2007
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20060043608
- Publication date Mar 2, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20040183182
- Publication date Sep 23, 2004
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Semiconductor device and a method of manufacturing thereof

Polymer layers embedded with metal pads for heat dissipation

Sintering materials and attachment methods using same

Low pressure sintering powder

Semiconductor device and a method of manufacturing thereof

Contact structures with porous networks for solder connections, and...

Method for electrical coupling and electric coupling arrangement

Electronic element and electronic device comprising the same

Engineered polymer-based electronic materials

Semiconductor device and a method of manufacturing thereof

Metal particle and articles formed therefrom

Adhesive composition, electronic-component-mounted substrate and se...

Metal particle and electroconductive paste formed therefrom

Resin fluxed solder paste, and mount structure

Sintered body made from silver fine particles

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Package with SoC and integrated memory

Semiconductor device and a method of manufacturing thereof

Structures and methods to enable a full intermetallic interconnect

Cu core ball

Method for manufacturing metal powder

Polymer layers embedded with metal pads for heat dissipation

Semiconductor package substrate, package system using the same and...

Metal particles having intermetallic compound nano-composite struct...

Electronic component module and method for manufacturing electronic...

Magnetic intermetallic compound interconnect

Electrode connection structure and electrode connection method

Patents Applicationslast 30 patents

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Polymer Layers Embedded with Metal Pads for Heat Dissipation

METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM

METAL PARTICLE AND ARTICLES FORMED THEREFROM

METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND

FORMATION OF CONDUCTIVE CIRCUIT

Polymer Layers Embedded with Metal Pads for Heat Dissipation

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

Guard Ring Design for Maintaining Signal Integrity

Test Structures for Post-Passivation Interconnect

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFA...

ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SE...

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...

Electronic component built-in substrate and method for manufacturin...

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Apparatus incorporating small-feature-size and large-feature-size c...

LOW STRESS CONDUCTIVE POLYMER BUMP

LOW STRESS CONDUCTIVE POLYMER BUMP

Circuit substrate for packaging semiconductor device, method for pr...

Apparatus incorporating small-feature-size and large-feature-size c...