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with a principal constituent of the material being a metal or a metalloid
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H01L2224/293
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/293
with a principal constituent of the material being a metal or a metalloid
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last 30 patents
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Patent Grant
TFT array substrate and display panel including the same
Patent number
11,978,743
Issue date
May 7, 2024
Everdisplay Optronics (Shanghai) Co., Ltd
Keitaro Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy augmentation structures, and their use in adhesive bonding
Patent number
11,964,166
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy augmentation structures for use with energy emitters and col...
Patent number
11,964,167
Issue date
Apr 23, 2024
Immunolight, LLC
Frederic A Bourke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid backside thermal structures for enhanced IC packages
Patent number
11,948,906
Issue date
Apr 2, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composition for provisional fixation and method for producing bonde...
Patent number
11,945,974
Issue date
Apr 2, 2024
Mitsui Mining & Smelting Co., Ltd.
Kei Anai
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Electronic device and manufacturing method of electronic device
Patent number
11,948,908
Issue date
Apr 2, 2024
Japan Display Inc.
Kazuyuki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate
Patent number
11,948,907
Issue date
Apr 2, 2024
Nitto Denko Corporation
Ryota Mita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and connected structure
Patent number
11,923,335
Issue date
Mar 5, 2024
Dexerials Corporation
Seiichiro Shinohara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package system and method
Patent number
11,901,319
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer substrate
Patent number
11,901,325
Issue date
Feb 13, 2024
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing bonded object and semiconductor device and cop...
Patent number
11,890,681
Issue date
Feb 6, 2024
Resonac Corporation
Yuki Kawana
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device having a resin that seals a rewiring
Patent number
11,894,325
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Manato Kurata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanowires plated on nanoparticles
Patent number
11,869,864
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal transfer structures for semiconductor die assemblies
Patent number
11,862,611
Issue date
Jan 2, 2024
Micron Technology, Inc.
Ed A. Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device including anisotropic conductive film and method of...
Patent number
11,864,437
Issue date
Jan 2, 2024
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inverter
Patent number
11,837,523
Issue date
Dec 5, 2023
Tesla, Inc.
Wenjun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display module and manufacturing method thereof
Patent number
11,817,414
Issue date
Nov 14, 2023
Samsung Electronics Co., Ltd.
Won Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
Patent number
11,817,418
Issue date
Nov 14, 2023
Infineon Technologies AG
Wei Lee Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,810,886
Issue date
Nov 7, 2023
Japan Display Inc.
Masanobu Ikeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,810,881
Issue date
Nov 7, 2023
Rohm Co., Ltd.
Bungo Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element bonding structure, method for producing semic...
Patent number
11,810,885
Issue date
Nov 7, 2023
Waseda University
Kohei Tatsumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill for chip packaging and chip packaging structure
Patent number
11,804,463
Issue date
Oct 31, 2023
Wuhan Choice Technology Co, Ltd
De Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonding structures and semiconductor devices including the same
Patent number
11,804,462
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Kunmo Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure comprising heat dissipation member
Patent number
11,804,417
Issue date
Oct 31, 2023
TECAT TECHNOLOGIES (SUZHOU) LIMITED
Choon Leong Lou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting sheet, dicing die bonding film, and semiconductor app...
Patent number
11,791,302
Issue date
Oct 17, 2023
Nitto Denko Corporation
Rena Kojima
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20240162181
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
Publication number
20240153896
Publication date
May 9, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
Publication number
20240128210
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Amit Ashara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128225
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Hajung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
Publication number
20240115878
Publication date
Apr 11, 2024
Immunolight, LLC
Frederic A. BOURKE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240120252
Publication date
Apr 11, 2024
RENESAS ELECTRONICS CORPORATION
Nobuhiro KINOSHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
Publication number
20240120254
Publication date
Apr 11, 2024
DEXERIALS CORPORATION
Keisuke ARAMAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
Publication number
20240105663
Publication date
Mar 28, 2024
Laird Technologies, Inc.
Vijayaraghavan RAJAGOPAL
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
Publication number
20240096745
Publication date
Mar 21, 2024
Mayank Mayukh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
Publication number
20240067855
Publication date
Feb 29, 2024
COOLER MATERIALS TECHNOLOGY INC.
Po-Wen CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
Publication number
20240071927
Publication date
Feb 29, 2024
Applied Materials, Inc.
Shinjae Hwang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CONDUCTIVE COMPOSITION, DIE ATTACHMENT MATERIAL, PRESSURE-SINTERED...
Publication number
20240047406
Publication date
Feb 8, 2024
Namics Corporation
Koji SASAKI
B22 - CASTING POWDER METALLURGY
Information
Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
Publication number
20240038723
Publication date
Feb 1, 2024
International Business Machines Corporation
Jae-Woong Nah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
Publication number
20240030075
Publication date
Jan 25, 2024
Wuhan Choice Technology Co,Ltd
De WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
Publication number
20240021565
Publication date
Jan 18, 2024
Alpha Assembly Solutions Inc.
Angelo GULINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
Publication number
20240014091
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
Publication number
20240006370
Publication date
Jan 4, 2024
STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
ZELONG YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...
Publication number
20230420412
Publication date
Dec 28, 2023
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
Publication number
20230411335
Publication date
Dec 21, 2023
Kyocera Corporation
Masakazu FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
Publication number
20230411334
Publication date
Dec 21, 2023
BOARDTEK ELECTRONICS CORPORATION
CHIEN-CHENG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
Publication number
20230395463
Publication date
Dec 7, 2023
Micron Technology, Inc.
Sameer S. Vadhavkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
Publication number
20230395552
Publication date
Dec 7, 2023
Heraeus Deutschland GmbH & Co. KG
Wolfgang SCHMITT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
Publication number
20230386945
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
Publication number
20230378124
Publication date
Nov 23, 2023
Intel Corporation
Frederick Atadana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
Publication number
20230378209
Publication date
Nov 23, 2023
Semiconductor Components Industries, LLC
Chee Peng NEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
Publication number
20230361073
Publication date
Nov 9, 2023
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT
Publication number
20230361076
Publication date
Nov 9, 2023
INFINEON TECHNOLOGIES AG
Hermann Bechert
H01 - BASIC ELECTRIC ELEMENTS