with a principal constituent of the material being a metal or a metalloid

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H01L2224/373

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/373with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 10,840,166
- Issue date Nov 17, 2020
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component module and power module
- Patent number 10,741,474
- Issue date Aug 11, 2020
- Siemens Aktiengesellschaft
- Stefan Stegmeier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230134075
- Publication date May 4, 2023
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295923
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MODULE AND POWER MODULE
- Publication number 20180301392
- Publication date Oct 18, 2018
- Stefan Stegmeier
- H01 - BASIC ELECTRIC ELEMENTS