with a principal constituent of the material being a metal or a metalloid

Industry

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H01L2224/137

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/137with a principal constituent of the material being a metal or a metalloid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,585,246
- Issue date Feb 28, 2017
- Fujitsu Limited
- Teru Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,565,755
- Issue date Feb 7, 2017
- Fujitsu Limited
- Teru Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,397,063
- Issue date Jul 19, 2016
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 9,318,425
- Issue date Apr 19, 2016
- Fujitsu Limited
- Teru Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,030,001
- Issue date May 12, 2015
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 8,580,607
- Issue date Nov 12, 2013
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 8,530,360
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, semiconductor mounting module, mobile communica...
- Patent number 8,324,623
- Issue date Dec 4, 2012
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module having a semiconductor chip, a holder and a cou...
- Patent number 8,223,248
- Issue date Jul 17, 2012
- Hynix Semiconductor Inc.
- Seung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor mounting module, mobile communica...
- Patent number 7,943,518
- Issue date May 17, 2011
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 7,898,083
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Abram M Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 7,816,780
- Issue date Oct 19, 2010
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Variable width resilient conductive contact structures
- Patent number 7,435,108
- Issue date Oct 14, 2008
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for mounting electronic component on circuit board
- Patent number 6,981,317
- Issue date Jan 3, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device in which a plurality of electronic components...
- Patent number 6,940,175
- Issue date Sep 6, 2005
- Sharp Kabushiki Kaisha
- Yoshihide Iwazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for forming contacts on a semiconductor component by alignin...
- Patent number 6,283,358
- Issue date Sep 4, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for forming contacts on a semiconductor component...
- Patent number 6,186,392
- Issue date Feb 13, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a bump having a rugged side
- Patent number 6,088,236
- Issue date Jul 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between electrode pad on semiconductor device...
- Patent number 5,883,432
- Issue date Mar 16, 1999
- Ricoh Company, Ltd.
- Masahiro Higashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump having a rugged side, a semiconductor devi...
- Patent number 5,545,589
- Issue date Aug 13, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20140077351
- Publication date Mar 20, 2014
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20120025365
- Publication date Feb 2, 2012
- Tessera Research LLC
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20110299255
- Publication date Dec 8, 2011
- FUJITSU LIMITED
- Teru Nakanishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...
- Publication number 20110180900
- Publication date Jul 28, 2011
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...
- Publication number 20110143502
- Publication date Jun 16, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE
- Publication number 20100259657
- Publication date Oct 14, 2010
- Seung Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...
- Publication number 20100164061
- Publication date Jul 1, 2010
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...
- Publication number 20100148374
- Publication date Jun 17, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS
- Publication number 20090035959
- Publication date Feb 5, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor apparatus and manufacturing method of semiconductor a...
- Publication number 20080145607
- Publication date Jun 19, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscopic Assurance Coating for Lead-Free Solders
- Publication number 20080075872
- Publication date Mar 27, 2008
- Joseph D. Lichtenhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020190392
- Publication date Dec 19, 2002
- YOSHIHIDE IWAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Chip packages with sintered interconnects formed out of pads

Semiconductor component, semiconductor-mounted product including th...

Localized sealing of interconnect structures in small gaps

Electronic device

Electronic component

Microelectronic packages with nanoparticle joining

Semiconductor device

Semiconductor device and method of making bumpless flipchip interco...

Package on package structure and method of manufacturing the same

Stacked dual-chip packaging structure and preparation method thereof

Microelectronic packages with nanoparticle joining

Microelectronic packages with nanoparticle joining

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Electroconductive bonding material, method for bonding conductor, a...

Semiconductor chip, semiconductor mounting module, mobile communica...

Doping minor elements into metal bumps

Image sensor module having a semiconductor chip, a holder and a cou...

Semiconductor chip, semiconductor mounting module, mobile communica...

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Semiconductor apparatus and manufacturing method of semiconductor a...

Variable width resilient conductive contact structures

Method and device for mounting electronic component on circuit board

Semiconductor device in which a plurality of electronic components...

System for forming contacts on a semiconductor component by alignin...

Method and system for forming contacts on a semiconductor component...

Semiconductor device having a bump having a rugged side

Connection structure between electrode pad on semiconductor device...

Method of forming a bump having a rugged side, a semiconductor devi...

Patents Applicationslast 30 patents

TERMINAL AND CONNECTION METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

Doping Minor Elements into Metal Bumps

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

Doping Minor Elements into Metal Bumps

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...

Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...

IMAGE SENSOR MODULE

SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...

METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...

INTERCONNECT ASSEMBLIES AND METHODS

Semiconductor apparatus and manufacturing method of semiconductor a...

Nanoscopic Assurance Coating for Lead-Free Solders

Semiconductor device and manufacturing method thereof