with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/13286

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13286with a principal constituent of the material being a non metallic, non metalloid inorganic material

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Patents Grantslast 30 patents

Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents