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with a principal constituent of the material being a non metallic, non metalloid inorganic material

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  • CPC
  • H01L2224/81686
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81686with a principal constituent of the material being a non metallic, non metalloid inorganic material
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  • Information Patent Application

    MAGNETIC PARTICLE ATTACHMENT MATERIAL
    • Publication number 20110278351
    • Publication date Nov 17, 2011
    • Aleksandar Aleksov
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR