with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/29286

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29286with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 11,676,936
- Issue date Jun 13, 2023
- Nitto Denko Corporation
- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet and composite sheet
- Patent number 11,634,611
- Issue date Apr 25, 2023
- Nitto Denko Corporation
- Nao Kamakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 11,557,562
- Issue date Jan 17, 2023
- Dexerials Corporation
- Takeshi Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system low form factor interface thermal manag...
- Patent number 10,985,086
- Issue date Apr 20, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,685,933
- Issue date Jun 16, 2020
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,669,452
- Issue date Jun 2, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 10,134,704
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,735,125
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint structure, power module, power module substrate with h...
- Patent number 9,355,986
- Issue date May 31, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,287,230
- Issue date Mar 15, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 8,932,909
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
- Publication number 20230335696
- Publication date Oct 19, 2023
- STANLEY ELECTRIC CO., LTD
- Keima KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210098418
- Publication date Apr 1, 2021
- NITTO DENKO CORPORATION
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...
- Publication number 20210013125
- Publication date Jan 14, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190319003
- Publication date Oct 17, 2019
- DEXERIALS CORPORATION
- Takeshi MIYAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20170309586
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20140131855
- Publication date May 15, 2014
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and manufacturing method of electronic device

Manufacturing method for semiconductor device

Sheet and composite sheet

Anisotropic conductive film

Information handling system low form factor interface thermal manag...

Thermal bonding sheet and thermal bonding sheet with dicing tape

Thermal bonding sheet and thermal bonding sheet with dicing tape

Thermocompression for semiconductor chip assembly

Thermocompression for semiconductor chip assembly

Solder joint structure, power module, power module substrate with h...

Thermocompression for semiconductor chip assembly

Thermocompression for semiconductor chip assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...

ANISOTROPIC CONDUCTIVE FILM

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY