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with a principal constituent of the material being a non metallic, non metalloid inorganic material
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CPC
H01L2224/29886
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29886
with a principal constituent of the material being a non metallic, non metalloid inorganic material
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last 30 patents
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Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
Publication number
20240250055
Publication date
Jul 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
Publication number
20220278069
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsung KUO
H01 - BASIC ELECTRIC ELEMENTS