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with a principal constituent of the material being a non metallic, non metalloid inorganic material

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  • CPC
  • H01L2224/13486
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13486with a principal constituent of the material being a non metallic, non metalloid inorganic material
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Patents Grantslast 30 patents

  • Information Patent Grant

    Engineered polymer-based electronic materials
    • Patent number 10,682,732
    • Issue date Jun 16, 2020
    • Alpha Assembly Solutions Inc.
    • Ramakrishna Hosur Venkatagiriyappa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR