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with a principal constituent of the material being a non metallic, non metalloid inorganic material
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CPC
H01L2224/83686
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83686
with a principal constituent of the material being a non metallic, non metalloid inorganic material
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last 30 patents
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Patent Grant
Solder joint structure, power module, power module substrate with h...
Patent number
9,355,986
Issue date
May 31, 2016
Mitsubishi Materials Corporation
Shuji Nishimoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR