with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/29686

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29686with a principal constituent of the material being a non metallic, non metalloid inorganic material

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Patents Grantslast 30 patents

Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240213138
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Tae Yeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220216178
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220020725
- Publication date Jan 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20150262967
- Publication date Sep 17, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS