with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

CPC
H01L2224/45686

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45686with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, method of manufacturing the same, display panel,...
- Patent number 10,636,865
- Issue date Apr 28, 2020
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Ming Mao
- G02 - OPTICS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,115,656
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed circuit boards
- Patent number 8,492,898
- Issue date Jul 23, 2013
- Semblant Global Limited
- Frank Ferdinandi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with micro connecting elements and method for...
- Patent number 7,468,560
- Issue date Dec 23, 2008
- Infineon Technologies AG
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonds having pressure-absorbing balls
- Patent number 7,404,513
- Issue date Jul 29, 2008
- Texas Instruments Incorporated
- Sohichi Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi chip package
- Patent number 7,215,031
- Issue date May 8, 2007
- Oki Electric Industry Co., Ltd.
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding method, wire-bonding apparatus, and semiconductor devi...
- Patent number 5,285,949
- Issue date Feb 15, 1994
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding method, wire-bonding apparatus,and semiconductor devic...
- Patent number 5,152,450
- Issue date Oct 6, 1992
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding method, wire-bonding apparatus, and semiconductor devi...
- Patent number 4,998,002
- Issue date Mar 5, 1991
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...
- Publication number 20140264783
- Publication date Sep 18, 2014
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20110120594
- Publication date May 26, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Boards
- Publication number 20100025091
- Publication date Feb 4, 2010
- Frank Ferdinandi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Bonds Having Pressure-Absorbing Balls
- Publication number 20080251918
- Publication date Oct 16, 2008
- TEXAS INSTRUMENTS INCORPORATED
- SOHICHI KADOGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BO...
- Publication number 20080124547
- Publication date May 29, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
- Publication number 20070284415
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of IC packaging and method forming the same
- Publication number 20070057351
- Publication date Mar 15, 2007
- SILICON INTEGRATED SYSTEMS CORP.
- Chih-Tai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with micro connecting elements and method for...
- Publication number 20060185892
- Publication date Aug 24, 2006
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonds having pressure-absorbing balls
- Publication number 20060144907
- Publication date Jul 6, 2006
- Sohichi Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi chip package
- Publication number 20060097374
- Publication date May 11, 2006
- Yoshimi Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for wire bonding and method for producing a bonding con...
- Publication number 20050150932
- Publication date Jul 14, 2005
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040217458
- Publication date Nov 4, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040119172
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density integrated circuits and the method of packaging the same
- Publication number 20020093088
- Publication date Jul 18, 2002
- Daniel Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Method of forming an electrical contact and method of forming a chi...

Display substrate, method of manufacturing the same, display panel,...

Chip package and method of forming a chip package with a metal cont...

Semiconductor device

Method for manufacturing printed circuit boards

Reliable wire method

Core-jacket bonding wire

Semiconductor device with a layer including niobium, and/or tantalu...

Bonding wire for semiconductor

Reliable wire structure and method

Printed circuit boards

Connecting wire and method for manufacturing same

Semiconductor device with micro connecting elements and method for...

Wire bonds having pressure-absorbing balls

Multi chip package

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Electronic component of a high frequency current suppression type a...

Wire-bonding method, wire-bonding apparatus, and semiconductor devi...

Wire-bonding method, wire-bonding apparatus,and semiconductor devic...

Wire-bonding method, wire-bonding apparatus, and semiconductor devi...

Patents Applicationslast 30 patents

WIRE COATING APPARATUS

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

WIRE BONDING SYSTEMS AND RELATED METHODS

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...

RELIABLE WIRE STRUCTURE AND METHOD

Printed Circuit Boards

CORE-JACKET BONDING WIRE

RELIABLE WIRE STRUCTURE AND METHOD

Semiconductor Device and Bonding Wire

BONDING WIRE FOR SEMICONDUCTOR

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

Printed Circuit Boards

Wire Bonds Having Pressure-Absorbing Balls

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BO...

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

Structure of IC packaging and method forming the same

Semiconductor device with micro connecting elements and method for...

Wire bonds having pressure-absorbing balls

Multi chip package

Arrangement for wire bonding and method for producing a bonding con...

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Packaged IC using insulated wire

High density integrated circuits and the method of packaging the same

Electronic component of a high frequency current suppression type a...