with a principal constituent of the material being a non metallic, non metalloid inorganic material

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H01L2224/81486

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81486with a principal constituent of the material being a non metallic, non metalloid inorganic material

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Patents Grantslast 30 patents

Information Patent Grant
Electronic member, electronic part and manufacturing method therefor
- Patent number 8,400,777
- Issue date Mar 19, 2013
- Hitachi, Ltd.
- Eiichi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of connecting a semiconductor device to a wiring board
- Patent number 4,749,120
- Issue date Jun 7, 1988
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE
- Publication number 20110147177
- Publication date Jun 23, 2011
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR
- Publication number 20100195292
- Publication date Aug 5, 2010
- Hitachi, Ltd.
- Eiichi Ide
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR