with a principal constituent of the material being a polymer

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H01L2924/1679

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1679with a principal constituent of the material being a polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,271,468
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,157,813
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and direc...
- Patent number 10,090,173
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,991,184
- Issue date Jun 5, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 9,735,082
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-hermetic semiconductor package
- Patent number 9,721,859
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,355,997
- Issue date May 31, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,703,540
- Issue date Apr 22, 2014
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,367,469
- Issue date Feb 5, 2013
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer lid for a sensor package and method therefor
- Patent number 8,354,747
- Issue date Jan 15, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming monolithic CMOS-MEMS hybrid integrated, packaged...
- Patent number 8,101,469
- Issue date Jan 24, 2012
- Advanced Microfab, LLC
- G. Krishna Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip assembly with chip-scale packaging
- Patent number 8,093,714
- Issue date Jan 10, 2012
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiofrequency power semiconductor module with cavity housing, and...
- Patent number 7,417,198
- Issue date Aug 26, 2008
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package
- Patent number 5,753,972
- Issue date May 19, 1998
- StratEdge Corporation
- Deborah S. Wein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate structure
- Patent number 5,689,091
- Issue date Nov 18, 1997
- VLSI Technology, Inc.
- Ahmad Hamzehdoost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite composites for electronic packaging
- Patent number 5,650,592
- Issue date Jul 22, 1997
- Olin Corporation
- Harvey Cheskis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing coaxial connections for an electronic component...
- Patent number 5,323,533
- Issue date Jun 28, 1994
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE
- Publication number 20130187286
- Publication date Jul 25, 2013
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20130130441
- Publication date May 23, 2013
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20120115279
- Publication date May 10, 2012
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120104571
- Publication date May 3, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jin O. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING
- Publication number 20110140260
- Publication date Jun 16, 2011
- Sierra Monolithics, Inc.
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED...
- Publication number 20110003421
- Publication date Jan 6, 2011
- Advanced Microfab, LLC
- G. Krishna Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High-frequency power semiconductor module with a hollow housing and...
- Publication number 20060012016
- Publication date Jan 19, 2006
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3DIC packaging with hot spot thermal management features

Method for mounting an electrical component in which a hood is used...

3DIC packaging with hot spot thermal management features

Fabricating an integrated circuit chip module with stiffening frame...

Method of fabricating a chip module with stiffening frame and ortho...

3DIC packaging with hot spot thermal management features

Chip module with stiffening frame and orthogonal heat spreader

Shield cap and method for manufacturing the same

3DIC packaging with hot spot thermal management features

Method of fabricating a chip module with stiffening frame and direc...

Electronic module and method of manufacturing the same

Integrated circuit assemblies with reinforcement frames, and method...

Chip packages and methods of manufacture thereof

3DIC packaging with hot spot thermal management features

Semi-hermetic semiconductor package

Printed circuit board

Thermal hot spot cooling for semiconductor devices

Integrated circuit assemblies with reinforcement frames, and method...

Organic module EMI shielding structures and methods

Organic module EMI shielding structures and methods

Chip-scale semiconductor die packaging method

Chip-scale semiconductor die packaging method

Conductive polymer lid for a sensor package and method therefor

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged...

Chip assembly with chip-scale packaging

Radiofrequency power semiconductor module with cavity housing, and...

Microelectronics package

Multi-layer substrate structure

Graphite composites for electronic packaging

Method of producing coaxial connections for an electronic component...

Patents Applicationslast 30 patents

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

3DIC Packaging with Hot Spot Thermal Management Features

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

3DIC Packaging with Hot Spot Thermal Management Features

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING

METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED...

High-frequency power semiconductor module with a hollow housing and...