with a principal constituent of the material being a polymer

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H01L2224/3719

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3719with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Package structure for power device
- Patent number 11,183,439
- Issue date Nov 23, 2021
- Actron Technology Corporation
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a HEMT semiconductor device and structure therefor
- Patent number 9,214,423
- Issue date Dec 15, 2015
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE FOR POWER DEVICE
- Publication number 20210074604
- Publication date Mar 11, 2021
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER DEVICE
- Publication number 20210050320
- Publication date Feb 18, 2021
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL