with a principal constituent of the material being a polymer

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H01L2224/4579

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4579with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a coated metallic wire, method of removing in...
- Patent number 6,640,436
- Issue date Nov 4, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated fine metallic wire and method for fabricating semiconductor...
- Patent number 6,239,376
- Issue date May 29, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package capable of absorbing electromagnetic wave
- Publication number 20050093112
- Publication date May 5, 2005
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS