with a principal constituent of the material being a polymer

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H01L2224/0539

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0539with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,770,419
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,763,233
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FO...
- Publication number 20210249371
- Publication date Aug 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Jia-Zhe LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR REDUCING VOLUME OF RESOURCE ALLOCATION INF...
- Publication number 20190206826
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Hee-Kwun CHO
- H01 - BASIC ELECTRIC ELEMENTS