with a principal constituent of the material being a polymer

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H01L2224/8549

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8549with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,236,364
- Issue date Jan 12, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents