with a principal constituent of the material being a polymer

Follow

Industry

CPC
H01L2224/3729

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3729with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 10,840,166
- Issue date Nov 17, 2020
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230134075
- Publication date May 4, 2023
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295923
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS