with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/0589

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0589with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 8,716,864
- Issue date May 6, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic devices with semiconductor die attached with sintered me...

Electronic devices with semiconductor die coupled to a thermally co...

Preform structure for soldering a semiconductor chip arrangement, a...

Solderless die attach to a direct bonded aluminum substrate

Solderless die attach to a direct bonded aluminum substrate

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Patents Applicationslast 30 patents

Solderless Die Attach to a Direct Bonded Aluminum Substrate

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

Solderless Die Attach to a Direct Bonded Aluminum Substrate