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with a principal constituent of the material being a polymer
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H01L2224/1349
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/1349
with a principal constituent of the material being a polymer
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
11,450,639
Issue date
Sep 20, 2022
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Low pressure sintering powder
Patent number
10,998,284
Issue date
May 4, 2021
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
10,910,335
Issue date
Feb 2, 2021
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for electrical coupling and electric coupling arrangement
Patent number
10,833,049
Issue date
Nov 10, 2020
International Business Machines Corporation
Thomas J. Brunschwiler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic element and electronic device comprising the same
Patent number
10,825,787
Issue date
Nov 3, 2020
Innolux Corporation
Wei-Cheng Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Engineered polymer-based electronic materials
Patent number
10,682,732
Issue date
Jun 16, 2020
Alpha Assembly Solutions Inc.
Ramakrishna Hosur Venkatagiriyappa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
10,622,325
Issue date
Apr 14, 2020
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin fluxed solder paste, and mount structure
Patent number
10,440,834
Issue date
Oct 8, 2019
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirohisa Hino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sintered body made from silver fine particles
Patent number
10,369,667
Issue date
Aug 6, 2019
NAMICS CORPORATION
Makoto Kobayashi
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
10,170,440
Issue date
Jan 1, 2019
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing metal powder
Patent number
10,130,995
Issue date
Nov 20, 2018
Alpha Assembly Solutions Inc.
Nirmalya Kumar Chaki
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Electronic component-mounted structure, IC card and COF package
Patent number
9,516,749
Issue date
Dec 6, 2016
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yoshiyuki Wada
G02 - OPTICS
Information
Patent Grant
Junction and electrical connection
Patent number
9,142,518
Issue date
Sep 22, 2015
Napra Co., Ltd
Shigenobu Sekine
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus incorporating small-feature-size and large-feature-size c...
Patent number
7,214,569
Issue date
May 8, 2007
Alien Technology Corporation
Susan Swindlehurst
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
Publication number
20190109111
Publication date
Apr 11, 2019
EPISTAR CORPORATION
Shih-An LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20170256511
Publication date
Sep 7, 2017
Young Lyong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
Publication number
20130088839
Publication date
Apr 11, 2013
Fujitsu Limited
Takatoyo YAMAKAMI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
Publication number
20070117274
Publication date
May 24, 2007
Susan Swindlehurst
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
Publication number
20040183182
Publication date
Sep 23, 2004
Susan Swindlehurst
G06 - COMPUTING CALCULATING COUNTING