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with a principal constituent of the material being a polymer

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  • CPC
  • H01L2224/3769
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3769with a principal constituent of the material being a polymer
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Patents Applicationslast 30 patents

  • Information Patent Application

    RELIABLE SEMICONDUCTOR PACKAGES
    • Publication number 20210202339
    • Publication date Jul 1, 2021
    • UTAC Headquarters Pte. Ltd.
    • Surachai Uraisakul
    • H01 - BASIC ELECTRIC ELEMENTS