with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/2969

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2969with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and bonding method thereof
- Patent number 10,756,050
- Issue date Aug 25, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particle and preparation method thereof, conductive adhe...
- Patent number 10,479,914
- Issue date Nov 19, 2019
- BOE Technology Group Co., Ltd.
- Dezhi Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sinterable bonding material and semiconductor device using the same
- Patent number 10,446,518
- Issue date Oct 15, 2019
- Henkel AG & Co. KGaA
- Hajime Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,627,350
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clips
- Patent number 9,620,471
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package
- Patent number 7,466,012
- Issue date Dec 16, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230109292
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hwail JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Film Forming Compositions
- Publication number 20220017673
- Publication date Jan 20, 2022
- Fujifilm Electronic Materials U.S.A., Inc.
- Sanjay Malik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND BONDING METHOD THEREOF
- Publication number 20200043890
- Publication date Feb 6, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20170294404
- Publication date Oct 12, 2017
- HENKEL AG & GO. KGAA
- Hajime INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...
- Publication number 20170158926
- Publication date Jun 8, 2017
- Shin-Etsu Chemical Co., Ltd.
- Koichi TSUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE PARTICLE AND PREPARATION METHOD THEREOF, CONDUCTIVE ADHE...
- Publication number 20170088752
- Publication date Mar 30, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Dezhi XU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...
- Publication number 20170062374
- Publication date Mar 2, 2017
- Industry-Academic Cooperation Foundation, Yonsei University
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...
- Publication number 20170012022
- Publication date Jan 12, 2017
- FUJIFILM CORPORATION
- Kenta YOSHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160322327
- Publication date Nov 3, 2016
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...
- Publication number 20160272854
- Publication date Sep 22, 2016
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Power Semiconductor Package with Conductive Clips
- Publication number 20150262960
- Publication date Sep 17, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor package
- Publication number 20090008804
- Publication date Jan 8, 2009
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package
- Publication number 20060131760
- Publication date Jun 22, 2006
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Sintering materials and attachment methods using same

Member for semiconductor device

Package structure and bonding method thereof

Conductive particle and preparation method thereof, conductive adhe...

Sinterable bonding material and semiconductor device using the same

Method for producing member for semiconductor device and semiconduc...

Anisotropic conductive material, electronic device including anisot...

Method for manufacturing semiconductor device

Power semiconductor package with conductive clips

Solder preform and electronic component

Power semiconductor package

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

Dielectric Film Forming Compositions

PACKAGE STRUCTURE AND BONDING METHOD THEREOF

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME

LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...

CONDUCTIVE PARTICLE AND PREPARATION METHOD THEREOF, CONDUCTIVE ADHE...

ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...

Power Semiconductor Package with Conductive Clips

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Solder Preform and Electronic Component

Power semiconductor package

Power semiconductor package

Semiconductor device, circuit board, electro-optic device, electron...