TREA

with a principal constituent of the material being a polymer

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  • CPC
  • H01L2224/8179
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8179with a principal constituent of the material being a polymer
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Patents Applicationslast 30 patents

  • Information Patent Application

    LOW-STRESS DUAL UNDERFILL PACKAGING
    • Publication number 20150255312
    • Publication date Sep 10, 2015
    • International Business Machines Corporation
    • Peter J. Brofman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC PARTICLE ATTACHMENT MATERIAL
    • Publication number 20110278351
    • Publication date Nov 17, 2011
    • Aleksandar Aleksov
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR