with a principal constituent of the material being a polymer

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H01L2924/1779

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1779with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,626,333
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,879,194
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same, and substr...
- Patent number 9,991,187
- Issue date Jun 5, 2018
- Fujitsu Limited
- Motonobu Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366796
- Publication date Nov 25, 2021
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTR...
- Publication number 20150325495
- Publication date Nov 12, 2015
- FUJITSU LIMITED
- Motonobu SATO
- H01 - BASIC ELECTRIC ELEMENTS