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with a principal constituent of the material being a polymer
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CPC
H01L2224/0549
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/0549
with a principal constituent of the material being a polymer
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Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
Publication number
20240379480
Publication date
Nov 14, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS