Membership
Tour
Register
Log in
with a principal constituent of the material being a polymer
Follow
Industry
CPC
H01L2224/2999
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/2999
with a principal constituent of the material being a polymer
Industries
Overview
Organizations
People
Information
Impact
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128225
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Hajung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
Publication number
20220310546
Publication date
Sep 29, 2022
NAGASE CHEMTEX CORPORATION
Daisuke MORI
H01 - BASIC ELECTRIC ELEMENTS