with a principal constituent of the material being a polymer

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H01L2924/16176

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16176with a principal constituent of the material being a polymer

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Patents Grantslast 30 patents

Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,355,997
- Issue date May 31, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency semiconductor package and high-frequency semiconduct...
- Patent number 9,177,881
- Issue date Nov 3, 2015
- Kabushiki Kaisha Toshiba
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module
- Patent number 8,558,377
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin O Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...
- Publication number 20140252569
- Publication date Sep 11, 2014
- KABUSHIKI KAISHA TOSHIBA
- Yoshiyuki Ikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20120104572
- Publication date May 3, 2012
- Samsung Electro-Mechanics CO., LTD.
- Jin O. YOO
- H01 - BASIC ELECTRIC ELEMENTS