with a principal constituent of the material being a solid not provided for in groups H01L2924/157 - H01L2924/15791

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15793with a principal constituent of the material being a solid not provided for in groups H01L2924/157 - H01L2924/15791

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Patents Grantslast 30 patents

Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assembly and methods of forming thermal paths
- Patent number 9,780,079
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-containing substrates for LED packages
- Patent number 9,634,214
- Issue date Apr 25, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and method of manufacturing the same
- Patent number 9,299,651
- Issue date Mar 29, 2016
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS