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with a principal constituent of the material being a solid not provided for in groups H01L2224/138 - H01L2224/13891
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CPC
H01L2224/13893
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13893
with a principal constituent of the material being a solid not provided for in groups H01L2224/138 - H01L2224/13891
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last 30 patents
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Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
Publication number
20110226841
Publication date
Sep 22, 2011
Jun Wei
H01 - BASIC ELECTRIC ELEMENTS