with a principal constituent of the material being a solid not provided for in groups H01L2224/451 - H01L2224/45191

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CPC
H01L2224/45193

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45193with a principal constituent of the material being a solid not provided for in groups H01L2224/451 - H01L2224/45191

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binding wire and semiconductor package structure using the same
- Patent number 9,960,141
- Issue date May 1, 2018
- Beijing FUNATE Innovation Technology Co., Ltd.
- Yu-Quan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS
- Publication number 20180226322
- Publication date Aug 9, 2018
- Intel Corporation
- Chwee Lin Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20150311174
- Publication date Oct 29, 2015
- BEIJING FUNATE INNOVATION TECHNOLOGY CO., LTD.
- YU-QUAN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/451 - H01L2224/45191

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Method for processing an ultra-high density space interconnect lead...

Wire bonding methods and systems incorporating metal nanoparticles

Binding wire and semiconductor package structure using the same

Wire structure and semiconductor device having the same, and method...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS

BINDING WIRE AND SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

POLYMER CORE WIRE