with a principal constituent of the material being a solid not provided for in groups H01L2224/456 - H01L2224/45691

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H01L2224/45693

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45693with a principal constituent of the material being a solid not provided for in groups H01L2224/456 - H01L2224/45691

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Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire structure and semiconductor device having the same, and method...
- Patent number 9,373,602
- Issue date Jun 21, 2016
- Samsung Electronics Co., Ltd.
- Eun-kyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,004,094
- Issue date Aug 23, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colored conductive wires for a semiconductor package
- Patent number 7,145,251
- Issue date Dec 5, 2006
- Amkor Technology, Inc.
- Sang Hyun Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Color contacts for a semiconductor package
- Patent number 6,888,242
- Issue date May 3, 2005
- Amkor Technology, Inc.
- Sang Hyun Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...
- Publication number 20150061161
- Publication date Mar 5, 2015
- SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
- Eun-kyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20110011618
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20080061440
- Publication date Mar 13, 2008
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Colored conductive wires for a semiconductor package
- Publication number 20050156327
- Publication date Jul 21, 2005
- Amkor Technology, Inc.
- Sang Hyun Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040217458
- Publication date Nov 4, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040119172
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder balls and conductive wires for a semiconductor package, and...
- Publication number 20030219927
- Publication date Nov 27, 2003
- Sang Hyun Ryu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/456 - H01L2224/45691

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Method of forming an electrical contact and method of forming a chi...

Chip package and method of forming a chip package with a metal cont...

Wire structure and semiconductor device having the same, and method...

Reliable wire method

Reliable wire structure and method

Copper alloy bonding wire for semiconductor device

Copper alloy bonding wire for semiconductor device

Colored conductive wires for a semiconductor package

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Color contacts for a semiconductor package

Electronic component of a high frequency current suppression type a...

Patents Applicationslast 30 patents

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

WIRE BONDING SYSTEMS AND RELATED METHODS

WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD...

RELIABLE WIRE STRUCTURE AND METHOD

RELIABLE WIRE STRUCTURE AND METHOD

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Colored conductive wires for a semiconductor package

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Packaged IC using insulated wire

Solder balls and conductive wires for a semiconductor package, and...

Electronic component of a high frequency current suppression type a...