with a principal constituent of the material being a solid not provided for in groups H01L2224/056 - H01L2224/05691

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H01L2224/05693

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05693with a principal constituent of the material being a solid not provided for in groups H01L2224/056 - H01L2224/05691

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with conductive p...
- Patent number 11,955,446
- Issue date Apr 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,594,504
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive polymer liner and me...
- Patent number 11,569,189
- Issue date Jan 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,011,483
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,978,655
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,496,198
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
- Publication number 20230307408
- Publication date Sep 28, 2023
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS DIRECT HYBRID BONDING
- Publication number 20230197655
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...
- Publication number 20230078105
- Publication date Mar 16, 2023
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...
- Publication number 20220068855
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NIckel Alloy for Semiconductor Packaging
- Publication number 20210242151
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200006269
- Publication date Jan 2, 2020
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel Alloy for Semiconductor Packaging
- Publication number 20190259717
- Publication date Aug 22, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
- Publication number 20120175755
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/056 - H01L2224/05691

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Insulating paste-based conductive device and manufacturing method t...

Method for forming semiconductor device structure with conductive p...

Display device

Nickel alloy for semiconductor packaging

Semiconductor device structure with conductive polymer liner and me...

Method of assembly by direct bonding between two elements, each ele...

Nickel alloy for semiconductor packaging

Semiconductor devices

Final passivation for wafer level warpage and ULK stress reduction

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Package on-package (PoP) structure including stud bulbs

Integration of backside heat spreader for thermal management

Package on-Package (PoP) structure including stud bulbs and method

Integration of backside heat spreader for thermal management

Package-on-package (PoP) structure including stud bulbs and method

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING DISPLAY PANEL

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...

LOW STRESS DIRECT HYBRID BONDING

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE P...

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE POLYMER LINER AND ME...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

NIckel Alloy for Semiconductor Packaging

SEMICONDUCTOR DEVICES

Nickel Alloy for Semiconductor Packaging

Package-On-Package (PoP) Structure Including Stud Bulbs

Package-On-Package (PoP) Structure Including Stud Bulbs

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Package-On-Package (PoP) Structure and Method

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER