with a principal constituent of the material being a solid not provided for in groups H01L2924/167 - H01L2924/16791

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H01L2924/16793

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16793with a principal constituent of the material being a solid not provided for in groups H01L2924/167 - H01L2924/16791

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and direc...
- Patent number 10,090,173
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2924/167 - H01L2924/16791

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabricating an integrated circuit chip module with stiffening frame...

Method of fabricating a chip module with stiffening frame and ortho...

Chip module with stiffening frame and orthogonal heat spreader

Method of fabricating a chip module with stiffening frame and direc...

Thermal hot spot cooling for semiconductor devices

Organic module EMI shielding structures and methods

Organic module EMI shielding structures and methods

Patents Applicationslast 30 patents

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS