with a principal constituent of the material being a solid not provided for in groups H01L2224/814 - H01L2224/81491

Industry

CPC
H01L2224/81493

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81493with a principal constituent of the material being a solid not provided for in groups H01L2224/814 - H01L2224/81491

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer and method fo...
- Patent number 11,302,537
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module allowing fine tuning after assembly
- Patent number 9,155,198
- Issue date Oct 6, 2015
- EAGANTU LTD.
- Michael Dakhiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,299,605
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Veeraraghavan S Basker
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20230335411
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER
- Publication number 20220238352
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...
- Publication number 20210313195
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140334120
- Publication date Nov 13, 2014
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...
- Publication number 20130228916
- Publication date Sep 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20120168931
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE
- Publication number 20110147177
- Publication date Jun 23, 2011
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20090121343
- Publication date May 14, 2009
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY

with a principal constituent of the material being a solid not provided for in groups H01L2224/814 - H01L2224/81491

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with nickel layer

High-speed RFID tag assembly using impulse heating

Chip package structure with conductive adhesive layer

Chip package structure with conductive adhesive layer and method fo...

High-speed RFID tag assembly using impulse heating

Chip packaging method and chip package using hydrophobic surface

Electronic module allowing fine tuning after assembly

Carbon nanotube structures for enhancement of thermal dissipation f...

Structure, electronic device, and method for fabricating a structure

Carbon nanotube structures for enhancement of thermal dissipation f...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...