with a principal constituent of the material being a solid not provided for in groups H01L2224/834 - H01L2224/83491

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H01L2224/83493

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83493with a principal constituent of the material being a solid not provided for in groups H01L2224/834 - H01L2224/83491

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device
- Patent number 10,989,396
- Issue date Apr 27, 2021
- Epistar Corporation
- Chih-Ping Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device
- Patent number 10,655,826
- Issue date May 19, 2020
- Epistar Corporation
- Chih-Ping Ho
- F21 - LIGHTING
Information Patent Grant
Bonding method of fixing an object to a rough surface
- Patent number 10,483,231
- Issue date Nov 19, 2019
- Tsinghua University
- Xiang Jin
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device package having an underfill barrier
- Patent number 10,217,649
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device capable of decreasing shadow of lighting effect
- Patent number 9,368,483
- Issue date Jun 14, 2016
- Formosa Epitaxy Incorporation
- Chi-Chih Pu
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20230197555
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- XIAOYANG JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
- Publication number 20230197665
- Publication date Jun 22, 2023
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE
- Publication number 20190206830
- Publication date Jul 4, 2019
- TSINGHUA UNIVERSITY
- XIANG JIN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20140103369
- Publication date Apr 17, 2014
- Formosa Epitaxy Incorporation
- Chi-Chih Pu
- F21 - LIGHTING

with a principal constituent of the material being a solid not provided for in groups H01L2224/834 - H01L2224/83491

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Graphene-coated heat spreader for integrated circuit device assemblies

Jointing material, fabrication method for semiconductor device usin...

Soldering a conductor to an aluminum layer

Semiconductor package

Illumination device

Semiconductor packaging structure and process

Illumination device

Bonding method of fixing an object to a rough surface

Semiconductor device package having an underfill barrier

Semiconductor packaging structure and process

Composite substrate with alternating pattern of diamond and metal o...

Semiconductor packaging structure and process

Illumination device capable of decreasing shadow of lighting effect

Patents Applicationslast 30 patents

GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

HEIGHT ADAPTABLE MULTILAYER SPACER

BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

Semiconductor Packaging Structure and Process

ILLUMINATION DEVICE