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with a principal constituent of the material being a solid not provided for in groups H01L2224/294 - H01L2224/29491
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H01L2224/29493
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29493
with a principal constituent of the material being a solid not provided for in groups H01L2224/294 - H01L2224/29491
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Patents Grants
last 30 patents
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Patent Grant
Anisotropic conductive adhesive with reduced migration
Patent number
9,365,749
Issue date
Jun 14, 2016
Sunray Scientific, LLC
S. Kumar Khanna
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Circuit component and method of making the same
Patent number
9,019,714
Issue date
Apr 28, 2015
Hitachi Chemical Company, Ltd.
Kazuya Sato
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
Publication number
20240194628
Publication date
Jun 13, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20240194629
Publication date
Jun 13, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
Publication number
20140353540
Publication date
Dec 4, 2014
SUNRAY SCIENTIFIC, LLC
S. Kumar Khanna
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
Publication number
20130292168
Publication date
Nov 7, 2013
ROBERT BOSCH GmbH
Daniel Wolde-Giorgis
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
Publication number
20130120948
Publication date
May 16, 2013
HITACHI CHEMICAL CO., Ltd.
Kazuya Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
Publication number
20120118480
Publication date
May 17, 2012
Kyung-Wook PAIK
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATER...
Publication number
20100065311
Publication date
Mar 18, 2010
Hitachi Chemical Company, Ltd.
Masaru Tanaka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR