TREA

with a principal constituent of the material being a solid not provided for in groups H01L2224/053 - H01L2224/05391

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  • CPC
  • H01L2224/05393
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05393with a principal constituent of the material being a solid not provided for in groups H01L2224/053 - H01L2224/05391
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Patents Grantslast 30 patents

  • Information Patent Grant

    Reliable interconnect
    • Patent number 9,960,130
    • Issue date May 1, 2018
    • UTAC HEADQUARTERS PTE. LTD.
    • Rui Huang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents