with a principal constituent of the material being a solid not provided for in groups H01L2224/051 - H01L2224/05191

Industry

CPC
H01L2224/05193

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05193with a principal constituent of the material being a solid not provided for in groups H01L2224/051 - H01L2224/05191

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,444
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Manikandan Arumugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having alignment pads and method of manufactur...
- Patent number 11,616,032
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene layers and method for fabricatin...
- Patent number 11,424,198
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using embedded carbon nanofibers
- Patent number 10,658,349
- Issue date May 19, 2020
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate package of chip on carrier and in cavity
- Patent number 10,522,433
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Durable bond pad structure for electrical connection to extreme env...
- Patent number 10,256,202
- Issue date Apr 9, 2019
- The United States of America as Represented by the Administrator of National...
- David J. Spry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-containing substrates for LED packages
- Patent number 9,634,214
- Issue date Apr 25, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,496,198
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,425,146
- Issue date Aug 23, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258257
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220293541
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS
- Publication number 20220093541
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...
- Publication number 20220068848
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...
- Publication number 20210242148
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Maurer
- G01 - MEASURING TESTING
Information Patent Application
Laminate package of chip on carrier and in cavity
- Publication number 20170316994
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-BASED METAL DIFFUSION BARRIER
- Publication number 20140339700
- Publication date Nov 20, 2014
- Fan Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074572
- Publication date Mar 29, 2012
- Thomas FISCHER
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/051 - H01L2224/05191

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with composite conductive features and method...

Semiconductor structure and manufacturing method thereof

Method for fabricating semiconductor device with graphene layers

Metal bump structure and manufacturing method thereof and driving s...

Semiconductor device having alignment pads and method of manufactur...

Bonded assembly employing metal-semiconductor bonding and metal-met...

Semiconductor device with graphene layers and method for fabricatin...

Interconnect using embedded carbon nanofibers

Laminate package of chip on carrier and in cavity

Durable bond pad structure for electrical connection to extreme env...

Integration of backside heat spreader for thermal management

Graphite-containing substrates for LED packages

Integration of backside heat spreader for thermal management

Semiconductor structure and method for making same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS

SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...

SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...

Laminate package of chip on carrier and in cavity

GRAPHENE-BASED METAL DIFFUSION BARRIER

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME