with a principal constituent of the material being a solid not provided for in groups H01L2224/136 - H01L2224/13691

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CPC
H01L2224/13693

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13693with a principal constituent of the material being a solid not provided for in groups H01L2224/136 - H01L2224/13691

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 9,735,123
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,293,577
- Issue date Oct 23, 2012
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming metal pillar
- Patent number 8,242,011
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,830,009
- Issue date Nov 9, 2010
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods of forming nano-coatings for improved adhesion between firs...
- Patent number 7,781,260
- Issue date Aug 24, 2010
- Intel Corporation
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP ELEMENT AND CHIP PACKAGE
- Publication number 20150171041
- Publication date Jun 18, 2015
- MUTUAL-PAK TECHNOLOGY CO., LTD.
- Po Ching CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL PILLAR
- Publication number 20120178251
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20110021016
- Publication date Jan 27, 2011
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming nano-coatings for improved adhesion between firs...
- Publication number 20090065932
- Publication date Mar 12, 2009
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20080169563
- Publication date Jul 17, 2008
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a solid not provided for in groups H01L2224/136 - H01L2224/13691

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alloy diffusion barrier layer

Semiconductor device structure and manufacturing method

Method for obtaining three-dimensional actin structures and uses th...

Method for transferring a graphene sheet to metal contact bumps of...

Semiconductor package and method of manufacturing the same

Method of forming metal pillar

Semiconductor package and method of manufacturing the same

Methods of forming nano-coatings for improved adhesion between firs...

Patents Applicationslast 30 patents

Coating of Nanowires

ALLOY DIFFUSION BARRIER LAYER

ALLOY DIFFUSION BARRIER LAYER

CHIP ELEMENT AND CHIP PACKAGE

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

METHOD OF FORMING METAL PILLAR

Semiconductor package and method of manufacturing the same

Methods of forming nano-coatings for improved adhesion between firs...

Semiconductor package and method of manufacturing the same