with a principal constituent of the material being a solid not provided for in groups H01L2224/292 - H01L2224/29291

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H01L2224/29293

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29293with a principal constituent of the material being a solid not provided for in groups H01L2224/292 - H01L2224/29291

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Anisotropic conductive film and display device using the same
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Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
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- Issue date Jun 6, 2023
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Information Patent Grant
Display module and manufacturing method thereof
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Information Patent Grant
Anisotropic conductive film and display device using the same
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Information Patent Grant
Connection body
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Information Patent Grant
Semiconductor die package including low stress configuration
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Information Patent Grant
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Information Patent Grant
Semiconductor devices and manufacturing method therefor
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Information Patent Grant
Semiconductor devices
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Information Patent Grant
Anisotropic conductive film, method of mounting semiconductor chip,...
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- Issue date Jul 2, 2002
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Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
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- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING BONDE...
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SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
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Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
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CONNECTION BODY
- Publication number 20160351531
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Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION
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Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR
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- G02 - OPTICS

with a principal constituent of the material being a solid not provided for in groups H01L2224/292 - H01L2224/29291

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding sheet and bonded structure

Hybrid backside thermal structures for enhanced IC packages

Composition for provisional fixation and method for producing bonde...

Anisotropic conductive film and display device using the same

Electroconductive film, roll, connected structure, and process for...

Display module and manufacturing method thereof

Anisotropic conductive film and display device using the same

Connection body

Semiconductor die package including low stress configuration

Semiconductor die package including low stress configuration

Semiconductor devices and manufacturing method therefor

Semiconductor devices

Anisotropic conductive film, method of mounting semiconductor chip,...

Patents Applicationslast 30 patents

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCON...

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

BONDING SHEET AND BONDED STRUCTURE

COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING BONDE...

SEMICONDUCTOR ELEMENT BONDING PORTION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

CONNECTION BODY

SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION

SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor devices and manufacturing method therefor

Liquid crystal display device and manufacturing method of liquid cr...